Clemson University, Clemson, S.C., has released its series of printed electronic initiatives sponsored by the Sonoco Institute of Packaging Design and Graphics and Clemson faculty.
The Sonoco Institute aims to provide:
•A state of the art printing capabilities and evaluation lab
•Collaborative resources from Advanced Material Engineering, Printing Technologies, and Packaging Science to fulfill contracted and sponsored printed electronics research
•Undergraduate- and graduate-level curriculum
•An internship and career development center
•Printed electronics educational seminars and hands-on workshops
Clemson University will host an event Jan. 22-23 that showcases its printed electronics activities. Attendees are invited to participate in the guidance of the curriculum, and provide input to develop lab, research and service capabilities.
The morning will offer a mix of presentations from the:
•Sonoco Institute of Packaging Design and Graphics
•Center for Optical Materials Science and Engineering Technologies (COMSET)
•The Department of Graphic Communications
•The Packaging Science Department
In the afternoon, working breakout groups will concentrate on lab facilities, research and development structure, curriculum and careers. Industry guests are offered the opportunity to provide advice, make recommendations, and interact with Clemson faculty and advisors to shape the Printed Electronics Applications and Research initiatives.
On Jan. 22, a Printed Electronics Primer presentation and session will be offered from 3 to 5 p.m. for attendees who are new to the market opportunities and technologies of printed electronics. This is also an opportunity for vendors to the printing and packaging industries to be introduced to this new market opportunity.
As an added bonus, the Clemson Tigers will host Wake Forest in a classic ACC match-up on the evening of Jan. 22. Please inquire if you are interested in attending.
For more information on the program, visit www.clemson.edu/sonoco_institute or email sonoco_institute@clemson.edu.
